Description: This textbook is a comprehensive deep dive into lead-free solder technology for microelectronic assemblies. Authored by more than 45 world-class researchers and practitioners, the numerous chapters discuss general reliability issues concerning microelectronic assemblies and factors of tin-rich alloys used in lead-free solders. It provides the reader real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and examines the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics. This handbook is a valuable resource for anyone interested in the subject of lead-free solder technology for microelectronic assemblies and is an essential resource for anyone working in the industry. ABOUT USWe are a 501(c)3 non-profit corporation. We sell books and other items donated by our community members to raise money for our local library system. We fund services, reading programs and purchases not in their budget. Our organization has operated continuously in the same city since 1937. PROCEEDS BENEFIT OUR LOCAL LIBRARY PROGRAMS - THANK YOU! Please visit our store for more titles.https://www.ebay.com/usr/friendsofthepaloaltolibrary
Price: 239 USD
Location: Palo Alto, California
End Time: 2025-01-30T18:00:16.000Z
Shipping Cost: 0 USD
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Item Specifics
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Personalized: No
Country/Region of Manufacture: United States
Number of Pages: 1048 Pages
Language: English
Publication Name: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Publisher: CRC Press LLC
Item Height: 2.2 in
Subject: Materials Science / General, Environmental Conservation & Protection, Green Business, Electronics / Microelectronics
Publication Year: 2004
Item Weight: 68.1 Oz
Type: Textbook
Author: Kathleen A. Stalter, Karl J. Puttlitz
Item Length: 10.3 in
Subject Area: Nature, Technology & Engineering, Business & Economics
Item Width: 7.3 in
Series: Mechanical Engineering Ser.
Format: Hardcover
